{"title":"A study of wafer level ESD testing","authors":"K. Yokoi, T. Watanabe","doi":"10.1109/EOSESD.2000.890021","DOIUrl":null,"url":null,"abstract":"This paper describes the possibility of performing the human body model (HBM) and machine model (MM) tests on a wafer. HBM capability when performed on a wafer is almost identical to that of a package; however, MM capability performed on a wafer is almost double that of a package due to the degradation of ESD pulses by parasitics in the equipment.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EOSESD.2000.890021","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper describes the possibility of performing the human body model (HBM) and machine model (MM) tests on a wafer. HBM capability when performed on a wafer is almost identical to that of a package; however, MM capability performed on a wafer is almost double that of a package due to the degradation of ESD pulses by parasitics in the equipment.