A Distributed-Ledger, Edge-Computing Architecture for Automation and Computer Integration in Semiconductor Manufacturing

Da-Yin Liao
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引用次数: 1

Abstract

Contemporary 300mm semiconductor manufacturing systems have highly automated and digitalized cyber-physical integration. They suffer from the profound problems of integrating large, centralized legacy systems with small islands of automation. With the recent advances in disruptive technologies, semiconductor manufacturing has faced dramatic pressures to reengineer its automation and computer integrated systems. This paper proposes a Distributed-Ledger, Edge-Computing Architecture (DLECA) for automation and computer integration in semiconductor manufacturing. Based on distributed ledger and edge computing technologies, DLECA establishes a decentralized software framework where manufacturing data are stored in distributed ledgers and processed locally by executing smart contracts at the edge nodes. We adopt an important topic of automation and computer integration for semiconductor research &development (R&D) operations as the study vehicle to illustrate the operational structure and functionality, applications, and feasibility of the proposed DLECA software framework.
面向半导体制造自动化和计算机集成的分布式账本、边缘计算体系结构
现代300mm半导体制造系统具有高度自动化和数字化的信息物理集成。他们面临着将大型、集中式遗留系统与小型自动化孤岛集成在一起的深刻问题。随着最近颠覆性技术的进步,半导体制造业面临着重新设计其自动化和计算机集成系统的巨大压力。本文提出了一种用于半导体制造自动化和计算机集成的分布式账本边缘计算体系结构(DLECA)。DLECA基于分布式账本和边缘计算技术,建立了一个去中心化的软件框架,其中制造数据存储在分布式账本中,并通过在边缘节点执行智能合约在本地进行处理。我们以半导体研究与发展(R&D)运作的自动化与电脑整合为研究主题,以说明所提出的DLECA软体架构的运作结构与功能、应用与可行性。
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