Communication Distance Enhancement of Transmission Line Coupler by Using Parallelized Driver ICs

Abstract

Non-contact communication can be realized by using a transmission line coupler. A highly durable system can be created by using contactless communication. The transmission line coupler has a trade-off relationship between long-distance transmission and compact packaging, which is an implementation issue. In this paper, we have developed a system that doubles the transmission power by parallelizing the driver ICs and achieves both compact packaging and communication distance enhancement.