H. Cheng, W. Chien, M. BrightSky, Y. Ho, Y. Zhu, A. Ray, R. Bruce, W. Kim, C. Yeh, H. Lung, C. Lam
{"title":"Novel fast-switching and high-data retention phase-change memory based on new Ga-Sb-Ge material","authors":"H. Cheng, W. Chien, M. BrightSky, Y. Ho, Y. Zhu, A. Ray, R. Bruce, W. Kim, C. Yeh, H. Lung, C. Lam","doi":"10.1109/IEDM.2015.7409620","DOIUrl":null,"url":null,"abstract":"Attempts to improve the retention so far must sacrifice switching speed. This work explores new phase change material based on pseudobinary GaSb-Ge system. The resulting new phase-change material has demonstrated fast switching speed of 80 ns, long endurance of 1G cycles and excellent data retention that survives 250°C-300 hrs. The 10 years-220°C data retention is the best ever reported. It is also the fastest material that can pass the solder bonding criteria for embedded automotive applications.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409620","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 35
Abstract
Attempts to improve the retention so far must sacrifice switching speed. This work explores new phase change material based on pseudobinary GaSb-Ge system. The resulting new phase-change material has demonstrated fast switching speed of 80 ns, long endurance of 1G cycles and excellent data retention that survives 250°C-300 hrs. The 10 years-220°C data retention is the best ever reported. It is also the fastest material that can pass the solder bonding criteria for embedded automotive applications.