Embedded Memories in System Design: Technology, Application, Design and Tools

Abstract

First, background will be provided on embedded DRAM process, circuit and market issues. The term system-on-silicon has been used to denote the integration of random logic, processor cores, SRAMs, ROMs, and analog components on the same die. But up to recently, one major component had been missing: high-density DRAMs. Today's technologies allow the integration of significant amounts of DRAM memory for applications such as data buffering, picture storage, and program/data storage. In quarter-micron technology, chips with up to 128 Mbit of DRAM and 500 kgates of logic are eminently feasible. This enlarges the system design space tremendously since system architects are no more restricted to standard commodity DRAMs. We will discuss the market for embedded DRAM applications as well as the associated challenges.