Effect of Water Deficit Stress on the Physiology, Growth and Leaf Cell Ultrastructure of Sorghum ( Sorghum bicolor r (L.) Moench)

W. Bayo, N. Rethman, P. Hammes, C. V. D. Merwe, J. Grimbeek, M. V. D. Linde
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Abstract

An experiment was conducted in growth chambers to study the response of sorghum cultivars to water deficit stress. Seven sorghum cultivars were evaluated under three water deficit levels [control (-0.05 MPa), mild stress (-0.27 MPa), and severe stress (-0.96 MPa)] in a hydroponic culture in a completely randomised block design replicated three times. The three water deficit levels were created by adding 0, 10 and 20% (w/v) polyethylene glycol 6000 (PEG 6000) to the nutrient solution. The results indicated that water deficit, especially severe water deficit (-0.96 MPa), severely affected the growth and physiology of sorghum. Water deficit stress reduced plant height, leaf area, dry matter accumulation, water use efficiency, root length, and stomatal density. Water deficit stress increased stomatal closure and thus leaf diffusive resistance. Stressed plants deposited larger amounts of epicuticular wax on leaf surfaces and stomatal openings. Water stress significantly reduced the amount of starch grains in the chloroplasts. Sorghum cultivars displayed distinctive response to water deficit stress for many of the parameters. Jigurti, Gambella 1107 and Meko grew better than P9403 and SA1486 under water deficit conditions. Jigurti showed no significant reduction in any of the growth parameters even under severe water deficit (-0.96 MPa) conditions. Keywords : Epicuticular wax; Leaf diffusive resistance; Leaf relative water content; Starch; Stomata; Water use efficiency. Ethiopian Journal of Biological Sciences Vol. 5 (2) 2006: pp. 161-176
水分亏缺胁迫对高粱生理、生长及叶片细胞超微结构的影响Moench)
通过室内试验研究了高粱品种对水分亏缺胁迫的响应。采用完全随机区组设计,对7个高粱品种在3种水分亏缺水平[对照(-0.05 MPa)、轻度胁迫(-0.27 MPa)和重度胁迫(-0.96 MPa)]下进行水培试验。通过在营养液中添加0、10和20% (w/v)的聚乙二醇6000 (PEG 6000)来产生三种水分亏缺水平。结果表明,水分亏缺特别是严重的水分亏缺(-0.96 MPa)严重影响了高粱的生长和生理。水分亏缺胁迫降低了株高、叶面积、干物质积累、水分利用效率、根长和气孔密度。水分亏缺胁迫增加了气孔关闭,从而增加了叶片的扩散阻力。受胁迫的植株在叶片表面和气孔上沉积了大量的表皮蜡质。水分胁迫显著降低了叶绿体中淀粉粒的数量。高粱品种对水分亏缺胁迫表现出不同的响应。吉古提、甘贝拉1107和麦可在水分亏缺条件下的生长情况优于P9403和SA1486。即使在严重水分亏缺(-0.96 MPa)条件下,吉古蒂的生长参数也没有显著降低。关键词:表皮蜡;叶片扩散阻力;叶片相对含水量;淀粉;气孔;用水效率。埃塞俄比亚生物科学杂志Vol. 5 (2) 2006: pp. 161-176
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