Terahertz Sources, Detectors, and Transceivers in Silicon Technologies

Li Zhuang, Cao Rui, Tao Xiaohui, Jiang Lihui, Rong Dawei
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引用次数: 1

Abstract

With active devices lingering on the brink of activity and every passive device and interconnection on chip acting as potential radiator, a paradigm shift from “ top-down ” to “ bottom-up ” approach in silicon terahertz (THz) circuit design is clearly evident as we witness orders-of-magnitude improvements of silicon THz circuits in terms of output power, phase noise, and sensitivity since their inception around 2010. That is, the once clear boundary between devices, circuits, and function blocks is getting blurrier as we push the devices toward their limits. And when all else fails to meet the system requirements, which is often the case, a logical step forward is to scale these THz circuits to arrays. This makes a lot of sense in the terahertz region considering the relatively efficient on-chip THz antennas and the reduced size of arrays with half-wavelength pitch. This chapter begins with the derivation of conditions for maximizing power gain of active devices. Discussions of circuit topologies for THz sources, detectors, and transceivers with emphasis on their efficacy and scalability ensue, and this chapter concludes with a brief survey of interface options for channeling THz energy out of the chip.
硅技术中的太赫兹源、探测器和收发器
随着有源器件徘徊在活动的边缘,每个无源器件和芯片上的互连都充当潜在的散热器,硅太赫兹(THz)电路设计从“自上而下”到“自下而上”的范式转变是显而易见的,因为我们见证了硅太赫兹(THz)电路在输出功率、相位噪声和灵敏度方面的数量级改进。也就是说,当我们将设备推向极限时,设备、电路和功能块之间曾经清晰的界限正变得越来越模糊。当所有其他的都不能满足系统的要求时,一个合乎逻辑的步骤是将这些太赫兹电路扩展到阵列。考虑到芯片上相对高效的太赫兹天线和半波长间距阵列的缩小尺寸,这在太赫兹区域非常有意义。本章从有源器件功率增益最大化条件的推导开始。讨论了太赫兹源、探测器和收发器的电路拓扑,重点讨论了它们的有效性和可扩展性,本章最后简要介绍了将太赫兹能量从芯片中传输出去的接口选项。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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