Zach Fredin, J. Zemánek, Camron Blackburn, Erik Strand, A. Abdel-Rahman, Premila Rowles, N. Gershenfeld
{"title":"Discrete Integrated Circuit Electronics (DICE)","authors":"Zach Fredin, J. Zemánek, Camron Blackburn, Erik Strand, A. Abdel-Rahman, Premila Rowles, N. Gershenfeld","doi":"10.1109/HPEC43674.2020.9286236","DOIUrl":null,"url":null,"abstract":"We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.","PeriodicalId":168544,"journal":{"name":"2020 IEEE High Performance Extreme Computing Conference (HPEC)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE High Performance Extreme Computing Conference (HPEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HPEC43674.2020.9286236","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.