Body Biasing Injection: Impact of substrate types on the induced disturbancesƒ

Abstract

Body Biasing Injection (BBI) is one of the most recent fault injection techniques. It consists of applying voltage pulses onto the substrate of integrated circuits (ICs) using a sharp needle. Because this technique is more recent, there is little information about the nature of the injected disturbances in the ICs. It is especially true if one considers that the substrate of microcontrollers can either be of dual or triple-well types, and thus can have different susceptibility to BBI. In previous work, a study of the effects of thinning the substrate of ICs on BBI and an electrical model were proposed. However, this study was only conducted for dual-well ICs. As a result, this paper provides enhanced electrical models to simulate the distribution of BBI disturbances through the different substrates, and it also gives a global view of the different BBI induced effects in relation to the nature of the substrate and the polarity of the injected voltage pulses.