Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

Abstract

Due to the high speed and low power trends, the design of the power distribution network (PDN) in multi-layer printed circuit board (PCB) becomes more important. This paper presents a fast and efficient analysis methodology for power/ground plane pair considering irregular shaped power plane and via effects in the frequency-domain. The proposed method uses parallel-plate transmission line theory and partitioning of the plane considering geometry properties. Using the popularly used circuit simulator SPICE, we have analyzed input-impedance of the power/ground plane pair. Due to the higher accuracy and the faster simulation time, the proposed method is applicable to the early design step of multi-layer PCB. Characteristic of power distribution network implemented by perforated plane is determined based on full-wave analysis using FDTD periodic structure modeling method.