Modelling and Design of Millimetrewave Passive Circuits: from 2 to 3D

Abstract

With the advances of microwave and millimetrewave circuit technology, fullwave electromagnetic approach has become necessary to model a number of phenomena (proximity effects, package interaction, crosstalk, etc.) dependent on complicated 3-D circuit configurations (multilevel circuits, vertical integration, multichip modules, finite metal thickness, etc.). This paper addresses a number of issues and reviews recent advances relevant to the modelling and optimisation of modern microwave circuits.