Formation of thin silicide films on Ta and Nb surfaces

E. Afanas’eva, S. M. Solov'ev
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Abstract

The mechanism of thin silicide film growth on Nb and Ta surfaces depended on the substrate temperature. At room temperature the layer-by-layer growth of Si on Ta and Nb took place. The surface density of Si in one monolayer was 9.3.10/sup 14/ at/cm/sup 2/ on Ta and Nb. The onset of the penetration Si into Nb and Ta was observed at T>900 K. At this temperature the composition NbSi/sub 2/ and TaSi/sub 2/ were formed. At temperature T>1360 K for Ta and T>1270 K for Nb a structural phase transition occurred and silicide Ta/sub 4/Si and Nb/sub 4/Si was formed after reaching a certain critical concentration of Si in the subsurface region. Phase transition was followed by increase of the Si atoms diffusion from the surface into the bulk.
在Ta和Nb表面形成硅化物薄膜
在Nb和Ta表面生长硅化物薄膜的机理与衬底温度有关。室温下,Si在Ta和Nb上逐层生长。Si在Ta和Nb上的表面密度为9.3.10/sup 14/ at/cm/sup 2/。在温度>900 K时,Si开始渗入Nb和Ta。在此温度下形成NbSi/sub - 2/和TaSi/sub - 2/组合物。当温度T>1360 K (Ta)和T>1270 K (Nb)时发生结构相变,在地下区域达到一定临界Si浓度后形成硅化物Ta/sub - 4/Si和Nb/sub - 4/Si。相变发生后,Si原子从表面向体体扩散增加。
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