Improved design for microplasma generation using planar interdigitated terminal (IDT) structure for explosive fuse applications

Abstract

This paper discusses about improved design for microplasma generation using a planar interdigitated terminal (IDT) structure. The IDT structure is fabricated by Au electroplating (5 µm) using a single mask process on quartz wafer. The gap between the subsequent IDT fingers is kept at 30 µm. The IDT structure showed microplasma generation at 570–580 V bias in atmospheric condition.