Physical modeling and design rules of analog Conductive Metal Oxide-HfO2 ReRAM

D. F. Falcone, S. Menzel, Tommaso Stecconi, A. L. Porta, Ludovico Carraria-Martinotti, B. Offrein, V. Bragaglia
{"title":"Physical modeling and design rules of analog Conductive Metal Oxide-HfO2 ReRAM","authors":"D. F. Falcone, S. Menzel, Tommaso Stecconi, A. L. Porta, Ludovico Carraria-Martinotti, B. Offrein, V. Bragaglia","doi":"10.1109/IMW56887.2023.10145936","DOIUrl":null,"url":null,"abstract":"Analog memristors are key building blocks to accelerate inference and training workloads of modern neural networks. This work provides a physical understanding and sets the design rules for novel filamentary Conductive Metal Oxide (CMO)-HfO2 Redox-based Resistive Switching Random Access Memory (ReRAM) devices. These Metal/CMO/Insulator/Metal structures show superior characteristics in terms of reduced switching stochasticity, higher number of non-volatile states and reproducibility upon switching with respect to conventional Metal/Insulator/Metal technology. The experimental data are described using a physics-based model in COMSOL Multiphysics 5.2 software. The simulations reveal the presence of a spreading resistance in the CMO acting as a current bottleneck in the Low Resistive State (LRS) while the oxidation of the CMO in a dome shape determines the High Resistive State (HRS). In addition, the role of the thickness and the electrical conductivity of the CMO, as well as the radius of the conductive filament, are explored for analog CMO-based ReRAM devices.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Memory Workshop (IMW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMW56887.2023.10145936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Analog memristors are key building blocks to accelerate inference and training workloads of modern neural networks. This work provides a physical understanding and sets the design rules for novel filamentary Conductive Metal Oxide (CMO)-HfO2 Redox-based Resistive Switching Random Access Memory (ReRAM) devices. These Metal/CMO/Insulator/Metal structures show superior characteristics in terms of reduced switching stochasticity, higher number of non-volatile states and reproducibility upon switching with respect to conventional Metal/Insulator/Metal technology. The experimental data are described using a physics-based model in COMSOL Multiphysics 5.2 software. The simulations reveal the presence of a spreading resistance in the CMO acting as a current bottleneck in the Low Resistive State (LRS) while the oxidation of the CMO in a dome shape determines the High Resistive State (HRS). In addition, the role of the thickness and the electrical conductivity of the CMO, as well as the radius of the conductive filament, are explored for analog CMO-based ReRAM devices.
模拟导电金属氧化物- hfo2 ReRAM的物理建模与设计规则
模拟忆阻器是加速现代神经网络推理和训练工作量的关键组成部分。这项工作为新型丝状导电金属氧化物(CMO)-HfO2氧化还原基电阻开关随机存取存储器(ReRAM)器件提供了物理理解并设定了设计规则。与传统的金属/绝缘体/金属技术相比,这些金属/CMO/绝缘体/金属结构在降低开关随机性、增加非易失性状态数量和开关可重复性方面表现出优越的特性。实验数据在COMSOL Multiphysics 5.2软件中使用基于物理的模型进行描述。模拟结果表明,在低阻态(LRS)中,CMO中扩散电阻的存在是电流瓶颈,而圆顶状的CMO氧化决定了高阻态(HRS)。此外,探讨了CMO的厚度、电导率以及导电丝的半径对模拟CMO的ReRAM器件的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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