Compound semiconductor physical device simulation for technology development at Motorola

O. Hartin, M. Ray, P. Li, K. Johnson
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引用次数: 3

Abstract

There is significant advantage to simulation-assisted device development in compound semiconductors At Motorola, 2D and 3D physics-based TCAD is heavily integrated into device development for communications. Effective simulation methods have been developed that allow us to reduce development cycle time, and cycles of learning to achieve cost competitive III-V market leading technologies. Our methodology includes analytical analysis, calibration to measured data, parameter study, and optimization of DC, small signal AC, RF, and thermal performance. This methodology has been used in pHEMT, HBT, and HIGFET development Application development, such as the pHEMT-based RF switch, has also used device simulation heavily. The fundamentals of this methodology will be discussed and examples from the technology areas will be presented.
摩托罗拉技术开发的化合物半导体物理器件模拟
在摩托罗拉,基于2D和3D物理的TCAD被大量集成到通信设备开发中。已经开发出有效的仿真方法,使我们能够缩短开发周期时间和学习周期,以实现具有成本竞争力的III-V市场领先技术。我们的方法包括分析分析、校准测量数据、参数研究以及优化直流、小信号交流、射频和热性能。该方法已用于pHEMT, HBT和HIGFET的开发。应用程序开发,如基于pHEMT的射频开关,也大量使用器件仿真。将讨论该方法的基本原理,并介绍技术领域的示例。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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