Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics

Fandi Bi, Birgit Vogel-Heuser, Fengmin Du, Nils Hanich, Ennuri Cho
{"title":"Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics","authors":"Fandi Bi, Birgit Vogel-Heuser, Fengmin Du, Nils Hanich, Ennuri Cho","doi":"10.1109/TechDebt59074.2023.00012","DOIUrl":null,"url":null,"abstract":"Underlying and undiscovered technical debt (TD) that burdens the system and makes future changes more costly or impossible poses significant risks to mechatronic systems. Multi-disciplinary collaboration and cooperation lead to interdisciplinary interfaces and new life cycle phases that cause greater ripple effects to the TD distribution. When quantifying TD contagiousness in interdisciplinary engineering, only a few metrics, methods, or tools prove applicable. In this work, we propose a method containing two key metrics to quantify TD contagiousness across product life cycles and disciplines. Furthermore, we suggest a matrix multiplication method to quantify the adverse impact on each discipline and the system. By applying the methods to the data of three comparable companies in the industrial automation domain, the results enable us to measure and prioritize the TD incidents’ contagiousness. This method provides a first step towards the systematic quantification of TD in the interdisciplinary environment and provides metrics to compare systems based on objective factors.","PeriodicalId":131882,"journal":{"name":"2023 ACM/IEEE International Conference on Technical Debt (TechDebt)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 ACM/IEEE International Conference on Technical Debt (TechDebt)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TechDebt59074.2023.00012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Underlying and undiscovered technical debt (TD) that burdens the system and makes future changes more costly or impossible poses significant risks to mechatronic systems. Multi-disciplinary collaboration and cooperation lead to interdisciplinary interfaces and new life cycle phases that cause greater ripple effects to the TD distribution. When quantifying TD contagiousness in interdisciplinary engineering, only a few metrics, methods, or tools prove applicable. In this work, we propose a method containing two key metrics to quantify TD contagiousness across product life cycles and disciplines. Furthermore, we suggest a matrix multiplication method to quantify the adverse impact on each discipline and the system. By applying the methods to the data of three comparable companies in the industrial automation domain, the results enable us to measure and prioritize the TD incidents’ contagiousness. This method provides a first step towards the systematic quantification of TD in the interdisciplinary environment and provides metrics to compare systems based on objective factors.
机电一体化领域技术债务传染度量与优先排序方法
潜在的和未发现的技术债务(TD)给系统带来负担,使未来的更改成本更高或不可能,这对机电系统构成了重大风险。多学科协作和合作导致了跨学科的界面和新的生命周期阶段,这对TD分布产生了更大的连锁反应。当量化跨学科工程中的TD传染性时,只有少数指标、方法或工具被证明是适用的。在这项工作中,我们提出了一种包含两个关键指标的方法来量化跨产品生命周期和学科的TD传染性。此外,我们建议采用矩阵乘法方法来量化对每个学科和系统的不利影响。通过将方法应用于工业自动化领域三家可比公司的数据,结果使我们能够衡量和优先考虑TD事件的传染性。该方法为跨学科环境中系统量化技术开发迈出了第一步,并提供了基于客观因素的系统比较指标。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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