{"title":"Super-resolution enhancement method with phase-shifting mask available for random patterns","authors":"A. Misaka, T. Matsuo, M. Sasago","doi":"10.1109/VLSIT.2002.1015452","DOIUrl":null,"url":null,"abstract":"We propose new two phase shifting masks: centerline phase-shifting mask (CL-PSM) and outline phase-shifting mask (OL-PSM). CL-PSM enhances the DOF of line patterns more than alternating phase-shifting masks. OL-PSM drastically improves the resolution of the contact pattern compared with attenuated phase-shifting masks. Both CL-PSM and OL-PSM are classified as strong resolution enhancement technologies. Furthermore, they can be applied to random logic patterns without multiple exposures. They will allow us to make sub-65-nm node logic LSIs with ArF lithography, and will also be useful for VUV lithography.","PeriodicalId":103040,"journal":{"name":"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)","volume":"13 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2002.1015452","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
We propose new two phase shifting masks: centerline phase-shifting mask (CL-PSM) and outline phase-shifting mask (OL-PSM). CL-PSM enhances the DOF of line patterns more than alternating phase-shifting masks. OL-PSM drastically improves the resolution of the contact pattern compared with attenuated phase-shifting masks. Both CL-PSM and OL-PSM are classified as strong resolution enhancement technologies. Furthermore, they can be applied to random logic patterns without multiple exposures. They will allow us to make sub-65-nm node logic LSIs with ArF lithography, and will also be useful for VUV lithography.