{"title":"Templating silicon nanowires seeded with oxygen reactive materials","authors":"M. Khayyat, B. Wacaser, M. Reuter, D. Sadana","doi":"10.1109/SIECPC.2011.5876982","DOIUrl":null,"url":null,"abstract":"The nanopatterning of semiconductors and other surfaces in a controlled manor is of a great interest for industrial application. The current technique is a new method of controlling the spatial placement of the growth of nanowires (NWs) seeded with oxygen reactive materials such as aluminum, which is a standard metal in silicon process line. The technique is based about patterning a semiconductor substrate or other like substrate which is capable of forming a semiconductor alloy with an oxygen reactive element during a subsequent annealing step. Moreover, it does not require removal of the patterned compound oxide layer.","PeriodicalId":125634,"journal":{"name":"2011 Saudi International Electronics, Communications and Photonics Conference (SIECPC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 Saudi International Electronics, Communications and Photonics Conference (SIECPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIECPC.2011.5876982","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
The nanopatterning of semiconductors and other surfaces in a controlled manor is of a great interest for industrial application. The current technique is a new method of controlling the spatial placement of the growth of nanowires (NWs) seeded with oxygen reactive materials such as aluminum, which is a standard metal in silicon process line. The technique is based about patterning a semiconductor substrate or other like substrate which is capable of forming a semiconductor alloy with an oxygen reactive element during a subsequent annealing step. Moreover, it does not require removal of the patterned compound oxide layer.