Dielectric Relaxation Performance of DRAM Storage Capacitors and Ways of Improvement

Z. A. Bai, Yixian Wang, Lixue Liu, Xi Zhang, Feng Yuan, Junsheng Meng, Zhongming Liu, Js Jeon, James Cho, Blacksmith Wu, Huihui Li, Guilei Wang, Chao Zhao, Kanyu Cao
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Abstract

Dielectric relaxation in high-κ storage capacitors can lead to significant degradation of capacitance values and hence deteriorate read bit-error rates of DRAMs. However, the mechanism of the dielectric relaxation phenomenon in high-κ dielectric oxides and multilayer stacks is still controversial. Moreover, previous work studied the dielectric relaxation phenomenon only at high-κ film level, which lacks the necessary insights into DRAM-specific complexities and performance improvement strategies. In this work, we first set up modeling and electric testing methodologies that can reliably collect and model dielectric relaxation signal in modern DRAM high-κ capacitors at both single-cell and chip levels. Experiment and simulation evidences based on these methodologies were then presented to identify and validate charge trapping-detrapping as the physical origin of dielectric relaxation in the frequency realm of DRAM operations. Dielectric relaxation performance improvement strategies were further provided, in particular for the latest storage capacitors with HfO2 being implemented.
DRAM存储电容器的介电弛豫性能及改进方法
高κ存储电容器中的介电松弛会导致电容值的显著退化,从而降低dram的读误码率。然而,高κ介电氧化物和多层堆叠中介电弛豫现象的机理仍存在争议。此外,先前的工作仅研究了高κ膜水平下的介电弛豫现象,缺乏对dram特定复杂性和性能改进策略的必要见解。在这项工作中,我们首先建立了建模和电测试方法,可以在单细胞和芯片水平上可靠地收集和模拟现代DRAM高κ电容器中的介电松弛信号。基于这些方法的实验和仿真证据,然后提出了识别和验证电荷捕获-去捕获是DRAM操作频率域介电弛豫的物理根源。进一步提出了改善介质弛豫性能的策略,特别是针对最新的HfO2存储电容器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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