Thermoelectric Properties of Ti Doping in Bismuth Telluride prepared by Powder Metallurgy Process

N. Kartika, A. Septiani, Melisa Permata Rosha, T. Kristiantoro, A. R. Nugraha, R. H. Mulyani, Dedi
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Abstract

The Ti-doped Bi2Te3 with concentrations 1, 3, and 5 in % Ti were synthesized using a simple powder metallurgy method. It is revealed that the optimum Ti addition in parent material changes the conduction type from undoped n-type into p-type with 1 % Ti concentration. However, the Ti addition above 1 % affects on decreasing the absolute Seebeck coefficient. Furthermore, the conduction type returns to w-type again at 5 % Ti addition. A 70 % and 74 % reduction in the absolute Seebeck coefficient and the electrical resistivity value, respectively, were found in 5 % Ti-doped at near room temperature. Even though the 5 % Ti doping concentration does not give an enhancement effect in the power factor (PF) value at near room temperature, there is a possibility of 5 % Ti-doped achieves a higher PF value than undoped Bi2Te3 at the higher temperature above 500 K.
粉末冶金法制备碲化铋中Ti掺杂的热电性能
采用简单的粉末冶金方法合成了浓度分别为1、3和5 % Ti的掺钛Bi2Te3。结果表明,在Ti浓度为1%的情况下,母材中最佳Ti添加量可使导电类型由未掺杂的n型转变为p型。而大于1%的Ti含量对绝对塞贝克系数的降低有影响。此外,当Ti含量为5%时,导电型又恢复为w型。在近室温下,掺5%钛的绝对塞贝克系数和电阻率值分别降低了70%和74%。虽然5% Ti掺杂浓度在近室温下对功率因数(PF)值没有增强作用,但在500 K以上的较高温度下,掺5% Ti有可能获得比未掺Bi2Te3更高的PF值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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