Development of Compact Coupler Devices on Electrody-Namic Structures with Different Thickness Substrates

D. Letavin, R. Abdullin
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引用次数: 2

Abstract

In this paper, using a program of electrodynamic analysis of the NI-AWR Design Environment 13, compact branch-line coupler were designed with different substrate thicknesses using electrodynamic structures. Based on the obtained results, the influence of the thickness of the material used on the effectiveness of miniaturization of coupler was analyzed. The process of reducing the geometric dimensions consists in replacing the quarter-wave segments by synthesized electrodynamic structures that have similar characteristics at the central frequency and in its vicinity. With the help of the AWR program, three designs of a branch-line coupler with a thickness of 1, and 1.5 mm have been analyzed and, from the data obtained, it can be concluded that the smaller the thickness of the substrate, the higher the efficiency of miniaturization of the coupler.
不同厚度基底电动力结构紧凑型耦合器的研制
本文利用NI-AWR设计环境13的电动力分析程序,采用电动力结构设计了不同衬底厚度的紧凑型支路耦合器。在此基础上,分析了材料厚度对耦合器小型化效果的影响。减小几何尺寸的过程是用在中心频率及其附近具有相似特征的合成电动力结构代替四分之一波段。利用AWR程序对1 mm和1.5 mm三种分支线耦合器的设计进行了分析,得到的数据表明,基板厚度越小,耦合器的小型化效率越高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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