Monitoring of the Effect of Thermal Shock on Crack Growth in Copper Through-Glass Via Substrates

C. Okoro, S. Jayaraman, S. Pollard
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引用次数: 2

Abstract

This work aims at understanding thermo-mechanically induced cracks in through-glass via (TGV) made in Corning® HPFS® Fused Silica glass substrate, as well as to study the effect of thermal shock on the propagation of cracks. Two types of thermo-mechanically induced cracks were observed; radial cracks formed during heating and circumferential cracks that are formed during cooling. These cracks were initiated as a result of high tensile stresses in the circumferential and radial directions respectively. Thermal shock was found to lead to the growth of radial cracks. After 1000 cycles, catastrophic failures occurred due to the networking of radial cracks from adjacent vias. This suggests that TGV pitch dimension is a critical parameter that needs to be considered in order to limit catastrophic failures. On the other hand, no crack growth was observed for circumferential cracks in the in-plane direction, even after 1000 cycles of thermal shock. These results indicate that the prevention of radial and circumferential crack formation is the most critical step in mitigating risk of failure concerns, thus, the need for optimized crack-free metallized TGV solutions. Through TGV shape re-design, control of Cu metallization thickness as well as the use of lower annealing heating rate, these thermo-mechanically driven cracks were successfully mitigated in a previously reported work.
热冲击对铜玻璃通孔衬底裂纹扩展影响的监测
本工作旨在了解康宁®HPFS®熔融石英玻璃基板中玻璃通孔(TGV)的热机械诱导裂纹,并研究热冲击对裂纹扩展的影响。观察到两种类型的热致裂纹;加热时形成的径向裂纹和冷却时形成的周向裂纹。这些裂纹分别是由高周向和径向拉应力引起的。热冲击导致径向裂纹的扩展。经过1000次循环后,由于相邻过孔的径向裂纹联网而发生灾难性失效。这表明TGV节距尺寸是一个需要考虑的关键参数,以限制灾难性失效。另一方面,即使在1000次热冲击循环后,也没有观察到面内方向的周向裂纹扩展。这些结果表明,防止径向和周向裂纹的形成是降低失效风险的最关键步骤,因此,需要优化无裂纹金属化TGV解决方案。通过重新设计TGV形状、控制Cu金属化厚度以及采用较低的退火加热速率,这些热机械驱动的裂纹在先前的研究中得到了成功的缓解。
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