Advances in direct-write printing of RF-MEMS using M3D

Abstract

We report an additive manufacturing process using in-house custom-made inks for the fabrication of ohmic contact RF MEMS switches. The fabrication involves multiple steps of additive printing using a conductive silver ink and a PMMA [poly(methyl methacrylate)] photoresistive polymer ink. The inks comply with the rheology requirements of the M3D material deposition system. Deposition is made at 40°C and feature sizes involve 10-20μm. The maximum temperature of the process depends on ink curing and was 250°C. A functional ohmic contact cantilever RF MEMS switch on flexible Kapton™ substrate was fabricated and tested successfully, and results are presented.