Integration the back-side inclined exposure technology to fabricate the 45° k-type prism with nanometer roughness

K. Hung, Y. Tsai, Chun-Fu Lee, Yi-Hao Chu
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引用次数: 2

Abstract

This paper describes the design for a special k-type microprism structure for application in the lateral-type blu-ray semiconductor laser of an optical pickup head system. This design solves the current frontal type blu-ray semiconductor laser problem, and thus reduces the size of the optical pickup head. This study combines front- and back- inclined exposure technology to develop a k-type microprism structure. Thick film negative photoresist are used in this study as the main structural material. For obtaining the optimal structural surface roughness, the effect of solvent loss percentage of the polymer material was controlled. Besides, the bottom half of the k-type was generated through backside exposure to solve problems such as diffraction phenomena due to uneven photoresist surface during front-side inclined exposure. This design also avoids the problem of refractive index matching by omitting the step of filling the gap between the mask and the photo resistor with glycerol. For improving the roughness problem of the front-side inclined exposure, backside inclined exposure is implemented when fabricating a 45 ° polymer micro mirror. The use of front-side exposure for making the top half of the k-type solves the problem of undesirable surface roughness caused by insufficient light penetration during front-side inclined exposure. This paper utilizes front- and back-side inclined exposure technology to fabricate a 45 ° k-type polymer micro mirror with 15.2 and 12.4 nm (400 μm × 400 μm) roughness, respectively. The roughness level could meet the standards (λ/10, λ = 405 nm) of blue ray specifications. This type of micro prism can be used as a key component in Pico-projector, Interferometer, bio detection systems, data storage systems, and linear encoder optical systems. This novel technology also has the characteristics of high throughput and wafer-level assembly.
结合背面倾斜曝光技术制备45°k型纳米粗糙度棱镜
本文设计了一种特殊的k型微棱镜结构,用于光学拾取头系统的横向蓝光半导体激光器。本设计解决了目前正面型蓝光半导体激光器的问题,从而减小了光学拾取头的尺寸。本研究结合前后倾斜曝光技术,开发了一种k型微棱镜结构。本研究采用厚膜负光刻胶作为主要结构材料。为了获得最佳的结构表面粗糙度,控制了聚合物材料溶剂损失百分比的影响。另外,k型的下半部分通过背面曝光产生,解决了正面倾斜曝光时光刻胶表面不均匀导致的衍射现象等问题。该设计还避免了折射率匹配的问题,省去了用甘油填充掩模和光电阻器之间的间隙的步骤。为了改善正面倾斜曝光的粗糙度问题,在制作45°聚合物微反射镜时采用了背面倾斜曝光。k型的上半部采用正面曝光,解决了正面倾斜曝光时光线穿透不足造成的表面粗糙度不理想的问题。利用正面和背面倾斜曝光技术分别制备了粗糙度为15.2 nm和12.4 nm (400 μm × 400 μm)的45°k型聚合物微镜。光洁度达到蓝光标准(λ/10, λ = 405 nm)。这种类型的微棱镜可以用作微型投影仪,干涉仪,生物检测系统,数据存储系统和线性编码器光学系统的关键部件。该新技术还具有高通量和晶圆级组装的特点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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