Software Metrics Proposal for Conformity Checking of Class Diagram to SOLID Design Principles

I. Oktafiani, B. Hendradjaya
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引用次数: 3

Abstract

Good software design quality is needed to reduce the number of errors in the implementation and testing phase. The SOLID design principles have been used as an object-oriented design guideline to meet software quality factors, such as understandability, flexibility, maintainability, and testability. In this paper we propose a set of metric to measure the conformity of class diagram to SOLID principles. In this study, we have analyzed the relationship between the concepts of SOLID principles with class diagram metrics, the metrics for each principles and the measurement techniques for class diagrams are produced. The proposed metrics for SRP, OCP, LSP, ISP, and DIP are respectively VSRP (Value of SRP), VOCP (Value of OCP), VLSP (Value of LSP), VISP (Value of ISP) and VDIP (Value of DIP). The metric has been validated using 15 class diagrams extracted from seven software applications. A spearman's rank correlation has been used and it has described the correlation between the metrics. This suggests that the proposed metrics have demonstrated their practicality.
类图符合SOLID设计原则的软件度量方案
良好的软件设计质量是减少实现和测试阶段错误数量的必要条件。SOLID设计原则已被用作面向对象的设计指导方针,以满足软件质量因素,如可理解性、灵活性、可维护性和可测试性。本文提出了一套度量方法来度量类图是否符合SOLID原则。在本研究中,我们分析了SOLID原则概念与类图度量之间的关系,产生了每个原则的度量和类图的度量技术。建议的SRP、OCP、LSP、ISP和DIP的度量分别是VSRP (SRP的值)、VOCP (OCP的值)、VLSP (LSP的值)、VISP (ISP的值)和VDIP (DIP的值)。使用从7个软件应用程序中提取的15个类图验证了这个度量。矛兵的等级相关性已经被使用,它描述了指标之间的相关性。这表明所提议的度量标准已经证明了它们的实用性。
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