Assembly of opto-mechanical devices

Abstract

A new generation of devices that connects or contains hybrid mechanical-, electrical-, and optical elements on the nano scale are being developed, with potential applications ranging from quantum-enabled hardware to different types of sensors. However, these hybrid optomechanical devices require innovative packaging with not only stress and strain free assembly with high vacuum and hermetic sealing typical of MEMS, but also optical access through windows, fiber alignment and pigtailing. Detailed description of such a module is provided.