A 206–294GHz 3-stage amplifier in 35nm InP mHEMT, using a thin-film microstrip environment

Z. Griffith, W. Ha, Peter Chen, Daehyun Kim, B. Brar
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引用次数: 7

Abstract

We present a compact, 3-stage millimeter-wave monolithic integrated circuit (MMIC) amplifier with an operating frequency of 206–294 GHz, formed by common-source configured 35 nm Lg InP mHEMTs and a multi-layer thin-film microstrip (TFM) wiring environment. The amplifier S21 mid-band gain is 11–16 dB, 3 dB bandwidth at 294 GHz, and 82.5 mW PDC. This is the first reported InP HEMT MMIC operating in G-, H-band employing thin-film microstrip. Because the TFM ground-plane shields the signal interconnects from the substrate, well behaved device (0.1–67, 140–200, 210–310 GHz) and amplifier (206–320 GHz) measurements are presented from an unthinned, 25 mil substrate. The total size of this 3-stage amplifier is only 0.77×0.40 mm2.
采用薄膜微带环境的35nm InP mHEMT中206-294GHz 3级放大器
我们提出了一种紧凑的3级毫米波单片集成电路(MMIC)放大器,其工作频率为206-294 GHz,由共源配置的35 nm Lg InP mhemt和多层薄膜微带(TFM)布线环境组成。放大器S21中频增益为11 - 16db, 294 GHz时带宽为3db,配电柜功率为82.5 mW。这是首次报道使用薄膜微带在G-, h波段工作的InP HEMT MMIC。由于TFM地平面屏蔽了信号互连与衬底之间的关系,因此在未薄的25mil衬底上提供了性能良好的器件(0.1 - 67,140 - 200,210 - 310 GHz)和放大器(206-320 GHz)测量。这个3级放大器的总尺寸仅为0.77×0.40 mm2。
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