A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure for evaluation of interface uniformity of the Ti-Al alloy/p-type 4H-SiC contact

Yen-Ling Chen, Shih-Hao Lai, Jian-Hao Lin, B. Tsui
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引用次数: 1

Abstract

A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure is proposed to characterize the Ti-Al alloy/p-type 4H-SiC contact. It is confirmed that the test structure can judge the uniformity of the contact interface without destructive analysis such as cross-sectional transmission electron microscopy. Comparing with the results of singlecontact CBKR structure, it is observed that the contact interface is non-uniform and the formation of low resistivity interface depends on the contact area. This area-dependence issue should be solved in order to improve the SiC power devices and CMOS ICs.
一种用于评价ti-铝合金/p型4H-SiC触点界面均匀性的多触点六端跨桥开尔文电阻(CBKR)结构
提出了一种多触点六端跨桥开尔文电阻(CBKR)结构来表征Ti-Al合金/p型4H-SiC触点。验证了该试验结构可以在不需要横断面透射电镜等破坏性分析的情况下,对接触界面的均匀性进行判断。与单接触CBKR结构的结果相比,观察到接触界面不均匀,低电阻率界面的形成取决于接触面积。为了改进SiC功率器件和CMOS集成电路,必须解决这一面积依赖性问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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