Adhesion improvement of thermoplastic isotropically conductive adhesive

S. Liong, C. Wong, W. Burgoyne
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引用次数: 7

Abstract

Generally, isotropically conductive adhesive formulations include epoxy resin as the polymeric matrix. Although epoxy has superior adhesion capability, its drawbacks include the tendency to absorb moisture and lack of reworkability (thermosetting polymer). In this study, a thermoplastic polymer with low moisture absorption (0.279wt%), called polyarylene ether (PAE2), is used in isotropically conductive adhesive (ICA) formulation. Previous research work by Lu et. al. (1999) showed that the moisture absorbed into epoxy caused galvanic corrosion, which results in the formation of metal oxide. By using a polymer with low moisture absorption, the amount of water present in ICA will be small, and the corrosion rate and formation of metal oxide can be reduced. However, previous measurements of contact resistance stability of PAE2-based ICA showed that they are not stable on all surface finishes. It was determined that for thermoplastic-based ICA, poor adhesion was the main mechanism for unstable contact resistance. Two methods of adhesion improvement are evaluated in this work. The first is to use coupling agents and the second is to blend the thermoplastic with epoxy. Both methods showed promise in improving the contact resistance stability of polyarylene ether based ICA.
热塑性各向同性导电胶粘剂粘接性能的改善
一般来说,各向同性导电胶粘剂配方包括环氧树脂作为聚合物基体。虽然环氧树脂具有优异的粘附能力,但它的缺点包括容易吸收水分和缺乏可再加工性(热固性聚合物)。在这项研究中,一种低吸湿率(0.279wt%)的热塑性聚合物,称为聚苯乙烯醚(PAE2),用于各向同性导电胶(ICA)配方。Lu etal .(1999)先前的研究表明,环氧树脂吸收的水分引起电偶腐蚀,从而形成金属氧化物。通过使用吸湿性低的聚合物,ICA中存在的水分会少,并且可以减少腐蚀速度和金属氧化物的形成。然而,先前对pae2基ICA的接触电阻稳定性的测量表明,它们在所有表面处理上都不稳定。结果表明,热塑性ICA的接触电阻不稳定的主要原因是粘结性差。本文对两种改善粘接的方法进行了评价。一是使用偶联剂,二是将热塑性塑料与环氧树脂共混。这两种方法都显示出改善聚芳醚基ICA接触电阻稳定性的希望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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