Heterogeneous Integration of Double Side SiP for IoT and 5G Application

Abstract

Double Side SiP is hot packaging solution by using double side SMT technology and dual side molding to shrink the overall module size. The calculation of package size can be reduce over 40% PCB placement area from 8 x 8mm to 6 x 6mm. Based on module level warpage and thermal dissipation performance point of view, the simulation and experiment including the molding process study with difference molding compound selection DOE to verify Double Side SiP warpage performance. The advantage of Double Side SiP, simplify PKG I/O Count (10% reduction based on PMIC of portable), to improve power supply efficiency and reduce noise emission. From electrical integration point of view, due to shorter signal transmission path to get good electrical performance (SI & PI) than other side by side flip chip base structure. From thermal performance, high thermal solution can be improved $\mathrm{24}\sim \mathrm{38}\%$. The Double Side SiP module can provide an advanced solution to address the module size, cost, performance, and time-to-market requirement for 5G and IoT marketing. The performance verification in this paper will proceed simulation and measurement. The reliability testing verification was including the TCT, HTSL and u-HAST (Temperature Cycle Test, High Temperature Storage Test, un-bias HAST) results as a verification for Double Side SiP structure. Finally, this paper have Double Side SiP structure and feasibility data for future 5G and IoT devices application.