SEM PACKAGING OF ADVANCED MODULAR AVIONICS

Abstract

A typical SEM module consists of two Circuit Card Assemblies (CCAs). Electronics contained on the CCAs achieve unparalleled circuit densities by using Application Specific Integrated Circuits (ASICs) with gate counts in excess of 100,000 gates and Multi-Chip Modules ( M C M s ) . The two CCAs mount back to back on a common heat sink and interconnect to the backplane through a single multi-pin connector. Each backplane connector type contains over 300 pins and has provisions for fiber. optic, RF (co-axial) and analog interconnects. Module cooling i s through convection from the rail edges or by forcing liquid through a hollow cored heat sink.