Development of heat dissipation structure for face-down bonded devices

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI:10.1109/IEMTIM.1998.704671

K. Nakakuki, Y. Takahashi, Y. Iguchi, K. Anasako, H. Shimamura

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引用次数: 1

Abstract

We developed a heat dissipation structure for face-down bonded surface acoustic wave (SAW) filter packages. This structure enables compact packages at low cost. Heat dissipation from the transmission (Tx) SAW filter and filter sealing are important factors in enhancing package reliability. Tx and reception (Rx) SAW filters were bonded on a printed wiring board (PWB) with a branching circuit, and the filters were sealed with a metallic lid using conductive adhesive. High thermal conductivity adhesive was used to fill between the Tx SAW filter and the metallic lid, enabling the heat of the Tx SAW filter to be dissipated. The filter properties of the package using this high thermal conductivity adhesive were not changed after 500 hour operation with 5 W input RF signals. Results following the performance of thermal shock tests also confirmed characteristics indicating an extremely tight seal, with a rate of helium leakage of only 10/sup -8/ atm/spl middot/cc/s. Thus, as indicated in detail by these results, we concluded that the structure which we developed has been proven to be suitable for application to SAW filter packages.

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面向下键合器件散热结构的研制

我们开发了一种面朝下粘合表面声波(SAW)滤波器封装的散热结构。这种结构可以实现低成本的紧凑封装。传输(Tx)声表面波滤波器的散热和滤波器密封是提高封装可靠性的重要因素。发送和接收(Rx)声表面波滤波器粘接在带有分支电路的印刷线路板(PWB)上，滤波器用导电粘合剂密封在金属盖上。使用高导热性粘合剂填充Tx SAW过滤器和金属盖之间，使Tx SAW过滤器的热量散发出去。使用这种高导热胶粘剂的封装在5w输入射频信号下运行500小时后，其过滤性能没有变化。热冲击测试后的结果也证实了密封非常紧密的特点，氦气泄漏率仅为10/sup -8/ atm/spl / middot/cc/s。因此，正如这些结果所详细指出的那样，我们得出的结论是，我们开发的结构已被证明适用于SAW滤波器封装。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)

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