A multistandard, triple band wireless transceiver in a 130 nm CMOS technology with integrated PAs for IoT applications

Abstract

This work presents a fully integrated multistandard, triple band wireless transceiver with integrated PAs. The narrowband transceiver is suitable for LoRaWAN, IEEE 802.15.4 (ZigBee), 802.15.4g (SUN) and Bluetooth to promote interoperability in future internet-of-things applications. With the presented architecture the unlicensed 2.4 GHz band and the ISM bands at 780–960 MHz and 390–510 MHz are supported with a single 1.5–2.0 GHz frequency synthesizer leading to an area efficient design. The output power for the low band is 20.0 dBm at 55% drain efficiency, for the mid band 24.3 dBm at 44 % drain efficiency and for the 2.4 GHz band 15.3 dBm at 43 % drain efficiency to allow high range applications without need of external PAs. The chip has been fabricated in a 130 nm CMOS technology.