Symmetric and programmable multi-chip module for rapid prototyping system

Mao-Hsu Yen, Sao-Jie Chen, S. Lan
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引用次数: 3

Abstract

To accelerate prototyping designs, we propose a new Symmetric and Programmable MCM (SPMCM) substrate, which consists of a symmetrical array of slots for bare-chip attachment and Field Programmable Interconnect Chips (FPICs) for substrate routing. Especially, the FPIC that we developed contains two kinds of polygonal routing modules and some virtual-wires to reduce the number of routing switches and pin count. For a bare-chip slot with 2n pads, the number of switches used in the polygonal routing module is less than the conventional routing module by /spl radic/(rF/sub C/n)/4 times, where the flexibility ratio r(F/sub C/) is close to 1.
用于快速成型系统的对称可编程多芯片模块
为了加速原型设计,我们提出了一种新的对称可编程MCM (SPMCM)基板,它由用于裸片连接的对称插槽阵列和用于基板路由的现场可编程互连芯片(fpic)组成。特别地,我们开发的FPIC包含两种多边形路由模块和一些虚拟线,以减少路由开关的数量和引脚数。对于2n个pad的裸片槽位,多边形路由模块使用的交换机数量比常规路由模块少4倍/spl radic/(rF/sub C/n)/,其中灵活性比r(F/sub C/)接近于1。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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