Soldering profile optimization for through-hole and surface mounted ceramic capacitors

Abstract

The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.