Design guideline for halo condition on CMOSFETs utilizing FLA

H. Tsujii, K. Adachi, K. Ohuchi, N. Aoki, T. Ito, K. Matsuo, K. Suguro, K. Ishimaru, H. Ishiuchi
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引用次数: 1

Abstract

We fabricated MOSFET devices using flash lamp annealing (FLA), and studied the halo profile dependence on CMOSFETs performance. Although FLA is high temperature anneal of 1000/spl deg/C or more and has soaking time corresponding to millisecond, it causes anomalous low level of halo dopant activation and redistribution. This anomaly degrades threshold voltage roll-off characteristics and Ion-Ioff characteristics. In this paper, we investigated halo dopant redistribution at each process step and the halo condition dependence of CMOSFETs characteristics, and proposed the design guideline of halo condition using FLA.
利用FLA的cmosfet光晕条件设计导则
我们利用闪光灯退火技术(FLA)制备了MOSFET器件,并研究了光晕轮廓对cmosfet性能的影响。虽然FLA是1000/spl℃以上的高温退火,且保温时间为毫秒级,但它会导致异常低水平的晕掺杂激活和再分布。这种异常降低了阈值电压滚降特性和离子off特性。本文研究了光晕掺杂剂在各个工艺步骤中的分布以及光晕条件对cmosfet特性的依赖关系,并提出了光晕条件设计准则。
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