Efficient full-wave analysis of packaging interconnects with bends using the method of moments

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250069

Zhaohui Zhu, S. Dvorak, J. Prince

引用次数: 1

Abstract

In this paper, a method of moments (MoM) based, full-wave layered interconnect simulator, UA-FWLIS is extended to handle interconnects with bends. The accuracy of this new bend-cell expansion function is investigated by comparing with Agilent Momentum.

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用矩量法对带弯头的封装连接件进行有效的全波分析

本文将基于矩量法(MoM)的全波分层互连模拟器UA-FWLIS扩展到具有弯曲的互连。通过与Agilent动量进行比较，研究了这种新的弯曲细胞膨胀函数的准确性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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