Improving Liquid Supply Pathways on Graphene Oxide Coated Surfaces for Enhanced Pool Boiling Heat Transfer Performance

A. Rishi, Anju Gupta, S. Kandlikar
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引用次数: 4

Abstract

Graphene is a two-dimensional material that possesses excellent thermal properties and thus has gained an enormous attention in the applications of heat transfer. In this work, we demonstrate the enhancement of boiling heat transfer performance on substrate coated with graphene oxide and/or copper composites. The graphene oxide and/or copper composites were introduced on the substrate by two commonly used coating techniques-dip-coating and a two-step electrochemical deposition method. The focus of this paper is to compare the morphologies, surface properties such as wickability and porosity rendered by these coating methods and compare the resultant heat transfer coefficients and critical heat fluxes. The surfaces were characterized by Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD), and Fourier Transform Infrared (FTIR) techniques. Critical Heat Flux of 220 W/cm2 at the wall superheat of 14.8°C was achieved for the highest 2.5% GO-Cu electrodeposited chip, while CHF of 128 W/cm2 at the wall superheat of 13.2°C was achieved for the 5 minutes dip coated test surface.
改善氧化石墨烯涂层表面的液体供应途径以提高池沸腾传热性能
石墨烯是一种二维材料,具有优异的热性能,因此在传热应用中受到了极大的关注。在这项工作中,我们证明了在涂有氧化石墨烯和/或铜复合材料的衬底上沸腾传热性能的增强。通过两种常用的涂层技术——浸涂和两步电化学沉积法,将氧化石墨烯和/或铜复合材料引入到衬底上。本文的重点是比较这些涂层方法所呈现的形貌,表面性能,如弹性和孔隙率,并比较所得的传热系数和临界热通量。采用扫描电镜(SEM)、x射线衍射(XRD)和傅里叶变换红外(FTIR)技术对其表面进行了表征。2.5% GO-Cu电沉积芯片的临界热流密度为220 W/cm2,壁热温度为14.8℃,而5分钟浸镀测试表面的临界热流密度为128 W/cm2,壁热温度为13.2℃。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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