{"title":"Program Committee Members","authors":"S. Gopalakrishnan","doi":"10.1109/GCCW.2006.74","DOIUrl":null,"url":null,"abstract":"Program Committee Members Hung-Chang Hsiao, National Cheng Kung University Gabor Kecskemeti, MTA SZTAKI Chandra Sekaran, NITK Xiaofei Wang, Seoul National University Craig Lee, The Aerospace Corporation Francisco Brasileiro, UFCG Saeid Abolfazli, University of Malaya Syed Ali Haider, SEECS-NUST Sheng Di, INRIA Vineet Chadha, Nvelo R& D, Samsung Josef Spillner, TU Dresden Eduardo Jacob, University of the Basque Country Gilles Fedak, INRIA, University of Lyon Ramin Yahyapour, GWDG University of Göttingen Erwin Laure, KTH/PDC Jiannong Cao, Hong Kong Polytechnic University Hong Xu, City University of Hong Kong Hemant Mehta, Senior Member, IEEE Xingwei Wang, Northeastern University Chunming Hu, Beihang University Alexandru Iosup, Delft University of Technology Annette Bieniusa, University of Kaiserslautern Thomas Bauschert, TU Chemnitz Pietro Michiardi, Eurecom Annappa B, NITK Tyng-Yeu Liang, National Kaohsiung University of Applied Sciences Oliver Hohlfeld, RWTH Aachen University Bo Yang, University of Electronic Science and Technology of China Jakub Szefer, Yale University David Hausheer, TU Darmstadt Rajesh Ingle, IEEE Pune Section Wolfgang Kellerer, Technische Universität München Tamas Lukovszki, Eötvös Loránd University, Budapest Burkhard Stiller, University of Zurich","PeriodicalId":432937,"journal":{"name":"2021 IEEE/ACM Sixth International Workshop on Emotion Awareness in Software Engineering (SEmotion)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE/ACM Sixth International Workshop on Emotion Awareness in Software Engineering (SEmotion)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GCCW.2006.74","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Program Committee Members Hung-Chang Hsiao, National Cheng Kung University Gabor Kecskemeti, MTA SZTAKI Chandra Sekaran, NITK Xiaofei Wang, Seoul National University Craig Lee, The Aerospace Corporation Francisco Brasileiro, UFCG Saeid Abolfazli, University of Malaya Syed Ali Haider, SEECS-NUST Sheng Di, INRIA Vineet Chadha, Nvelo R& D, Samsung Josef Spillner, TU Dresden Eduardo Jacob, University of the Basque Country Gilles Fedak, INRIA, University of Lyon Ramin Yahyapour, GWDG University of Göttingen Erwin Laure, KTH/PDC Jiannong Cao, Hong Kong Polytechnic University Hong Xu, City University of Hong Kong Hemant Mehta, Senior Member, IEEE Xingwei Wang, Northeastern University Chunming Hu, Beihang University Alexandru Iosup, Delft University of Technology Annette Bieniusa, University of Kaiserslautern Thomas Bauschert, TU Chemnitz Pietro Michiardi, Eurecom Annappa B, NITK Tyng-Yeu Liang, National Kaohsiung University of Applied Sciences Oliver Hohlfeld, RWTH Aachen University Bo Yang, University of Electronic Science and Technology of China Jakub Szefer, Yale University David Hausheer, TU Darmstadt Rajesh Ingle, IEEE Pune Section Wolfgang Kellerer, Technische Universität München Tamas Lukovszki, Eötvös Loránd University, Budapest Burkhard Stiller, University of Zurich