Potential and Electric Field Distribution Analysis of Field Limiting Ring and Field Plate by Device Simulator

C. Liao, F. Chien, Y. Tsai
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引用次数: 3

Abstract

Potential and strength of surface electric field distribution have strongly influence on breakdown voltage and reliability of power semiconductor devices. Potential distribution can be determined by different field-limiting ring and field plate design which can be described by solving Poisson's equation in one dimension briefly. In this paper, the influence of design factors such as spacing between main junction and ring, ring width, and field plate width on potential and strength of surface electric field distribution are analyzed. From the simulation results, the relationship between those factors and potential and strength of surface electric field distribution can be found. Understanding the effect of design factors upon the junction termination edge, multi field-limiting rings and field plates of high breakdown power devices can be designed.
用器件模拟器分析场限环和场板的电位和电场分布
表面电场分布的电位和强度对功率半导体器件的击穿电压和可靠性有很大的影响。不同的限场环和场板设计可以确定电势的分布,这种分布可以用一维的泊松方程来描述。本文分析了主结与环间距、环宽度、场板宽度等设计因素对表面电场分布电位和强度的影响。从仿真结果可以看出这些因素与表面电场分布的电位和强度之间的关系。了解设计因素对结端边的影响,可以设计出高击穿功率器件的多场限环和场极板。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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