SOI technology for front end applications

Z. Shaked, P. Hurwitz, A. Heiman, K. Moen, R. Kanawati, S. Chaudhry, M. Racanelli
{"title":"SOI technology for front end applications","authors":"Z. Shaked, P. Hurwitz, A. Heiman, K. Moen, R. Kanawati, S. Chaudhry, M. Racanelli","doi":"10.1109/COMCAS.2015.7360403","DOIUrl":null,"url":null,"abstract":"SOI processes have become the mainstream technology for wireless front end manufacturing following recent optimization of starting materials and fabrication processes. In this paper, we will describe such RFSOI platform for RF switches, the process optimizations and the devices offering required for efficient FEM design.","PeriodicalId":431569,"journal":{"name":"2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS)","volume":"120 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMCAS.2015.7360403","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

SOI processes have become the mainstream technology for wireless front end manufacturing following recent optimization of starting materials and fabrication processes. In this paper, we will describe such RFSOI platform for RF switches, the process optimizations and the devices offering required for efficient FEM design.
前端应用的SOI技术
随着最近对起始材料和制造工艺的优化,SOI工艺已成为无线前端制造的主流技术。在本文中,我们将描述用于射频开关的RFSOI平台,流程优化和提供有效FEM设计所需的器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书