Emerging manufacturing technologies for RFIC, antenna and RF-MEMS integration

Abstract

Insatiable demand for miniaturization and environmental friendly materials in next-generation electronic based products is driving the need for advanced low-cost and scalable manufacturing processes. To meet customers' needs today, ranging from communications to healthcare markets, tight integration of multiple functionalities is required. The conventional approach to multi-functional integration involves assembly and packaging of discrete components, active devices, etc. A holistic approach towards multi-functional integration to improve system cost-effectiveness, particularly for the next-generation RF microsystems and subsystems, is described, along with the unique manufacturing technologies.