Growth of Si-doped GaN Nanowires With Low Density For Power Device Applications

M. Benjelloun, Tanbir Sodhi, A. Kunti, L. Travers, A. Soltani, D. Morris, H. Maher, N. Gogneau, J. Harmand
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Abstract

In this work, the growth of low-density self-catalyzed n-doped gallium nitride (GaN) nanowires (NWs) on Si(111) substrate has been investigated for power device applications. In the first part of this study, the influence of the growth temperature on the morphology and the density of the NWs has been studied. We have found that the NWs density can be reduced to 1.55×109 NWs/cm2 at low growth temperature. However, under these conditions, a 1560 nm thick parasitic layer is also grown connecting the NWs by their bottom. To minimize this parasitic growth, we have developed a two-step growth procedure allowing us to maintain the NWs density around 1.91×109 NWs/cm2, while minimizing the parasitic layer’s thickness to 158 nm. In the second part, we have optimized the growth conditions to keep the NW characteristics (low density and thin parasitic layer) while inducing their n-type doping using silicon.
用于功率器件的低密度掺硅GaN纳米线的生长
在这项工作中,研究了在Si(111)衬底上生长低密度自催化n掺杂氮化镓(GaN)纳米线(NWs)的功率器件应用。在本研究的第一部分中,研究了生长温度对NWs形貌和密度的影响。我们发现在低生长温度下,NWs密度可以降低到1.55×109 NWs/cm2。然而,在这些条件下,也生长了一个1560nm厚的寄生层,通过它们的底部连接NWs。为了最小化这种寄生生长,我们开发了一种两步生长程序,使我们能够将NWs密度保持在1.91×109 NWs/cm2左右,同时将寄生层的厚度最小化到158 nm。在第二部分,我们优化了生长条件,以保持NW特性(低密度和薄寄生层),同时用硅诱导它们的n型掺杂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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