How to Achieve High Mobility Thin Film Transistors by Direct Deposition of Silicon Using 13.56 MHz RF PECVD?

C. Lee, A. Sazonov, J. Robertson, A. Nathan, M. Esmaeili-Rad, P. Servati, W. Milne
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引用次数: 3

Abstract

CMOS nanocrystalline silicon thin film transistors with high field effect mobility are reported. The transistors were directly deposited by radio-frequency plasma enhanced chemical vapor deposition at 150 degC. The transistors show maximum field effect mobility of 450 cm2/V-s for electrons and 100 cm2/V-s for holes at room temperature. We attribute the high mobilities to a reduction of the oxygen content, which acts as an accidental donor. Indeed, secondary ion mass spectrometry measurements show that the impurity concentration in the nanocrystalline Si layer is comparable to, or lower than, the defect density in the material, which is already low thanks to hydrogen passivation
如何利用13.56 MHz射频PECVD直接沉积硅实现高迁移率薄膜晶体管?
报道了具有高场效应迁移率的CMOS纳米晶硅薄膜晶体管。采用射频等离子体增强化学气相沉积法在150℃下直接沉积晶体管。在室温下,电子和空穴的最大场效应迁移率分别为450 cm2/V-s和100 cm2/V-s。我们将高流动性归因于氧含量的降低,氧含量作为一个偶然的供体。事实上,二次离子质谱测量表明,纳米晶硅层中的杂质浓度与材料中的缺陷密度相当,或者更低,由于氢钝化,材料中的缺陷密度已经很低了
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