{"title":"An electrical model of a NPT-IGBT including transient temperature effects realized with PSpice device equations modeling","authors":"O. Apeldoorn, S. Schmitt, R. D. De Doncker","doi":"10.1109/ISIE.1997.648939","DOIUrl":null,"url":null,"abstract":"To describe the electrical and thermal behaviour of an insulated gate bipolar transistor (IGBT) for circuit simulation, an analytical model is designed. The model uses a charge-control approach according to the HEFNER model. The effect of the transient chip-temperature on different physical parameters is defined by the thermal model. The numerical realization is made on the basis of nodal analysis and a linearization according to the Newton-Raphson method. All equations are implemented in C-code and combined with the simulator source code, using the PSpice device equation option. As a result, an internal model is created. Due to the thermal network, the IGBT has become a four terminal device. It can be applied to various thermal and electrical circuit topologies. A transient simulation of the device temperature allows short circuit or overload conditions to be studied in detail.","PeriodicalId":134474,"journal":{"name":"ISIE '97 Proceeding of the IEEE International Symposium on Industrial Electronics","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISIE '97 Proceeding of the IEEE International Symposium on Industrial Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISIE.1997.648939","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20
Abstract
To describe the electrical and thermal behaviour of an insulated gate bipolar transistor (IGBT) for circuit simulation, an analytical model is designed. The model uses a charge-control approach according to the HEFNER model. The effect of the transient chip-temperature on different physical parameters is defined by the thermal model. The numerical realization is made on the basis of nodal analysis and a linearization according to the Newton-Raphson method. All equations are implemented in C-code and combined with the simulator source code, using the PSpice device equation option. As a result, an internal model is created. Due to the thermal network, the IGBT has become a four terminal device. It can be applied to various thermal and electrical circuit topologies. A transient simulation of the device temperature allows short circuit or overload conditions to be studied in detail.