Boyang Liu, Chunsheng Guo, Sijin Wang, Hang Wei, Lei Wei
{"title":"Online Junction Temperature Measurement Method of SiC MOS Devices Using Multiple Electrical Parameters at Transient Surge Current","authors":"Boyang Liu, Chunsheng Guo, Sijin Wang, Hang Wei, Lei Wei","doi":"10.1109/ICEDME50972.2020.00018","DOIUrl":null,"url":null,"abstract":"This paper proposes a novel method for online junction temperature measurement of silicon carbide metaloxide-semiconductor field-effect transistors (SiC MOSFETs). The measurement method is using the miller plateau voltage (VGS) and source leakage current (IDS) at transient inrush currents during turn-on process that based on the temperaturesensitive electrical parameters measurement method (TSEP). The comparison of infrared temperature measurement results shows that this method can provide more accurate junction temperature results and also can be used for transient junction temperature measurement in SiC MOSFET devices. It solves the problem that the traditional temperature-sensitive electrical parameter measurement method is difficult to measure the transient temperature rise. Finally, the results show that the use of VGS and IDS can provide more accurate junction temperature results which can be used for transient junction temperatures in SiC MOSEFT devices.","PeriodicalId":155375,"journal":{"name":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","volume":"76 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDME50972.2020.00018","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper proposes a novel method for online junction temperature measurement of silicon carbide metaloxide-semiconductor field-effect transistors (SiC MOSFETs). The measurement method is using the miller plateau voltage (VGS) and source leakage current (IDS) at transient inrush currents during turn-on process that based on the temperaturesensitive electrical parameters measurement method (TSEP). The comparison of infrared temperature measurement results shows that this method can provide more accurate junction temperature results and also can be used for transient junction temperature measurement in SiC MOSFET devices. It solves the problem that the traditional temperature-sensitive electrical parameter measurement method is difficult to measure the transient temperature rise. Finally, the results show that the use of VGS and IDS can provide more accurate junction temperature results which can be used for transient junction temperatures in SiC MOSEFT devices.