Innovative 3D Heterogeneous Chip Manufacturing Approach to the Problem of Approaching Physical Limits with Traditional Chip Manufacturing Technologies

Abstract

The 3D heterogeneous chip manufacturing approach is an innovative technological approachthat has significant future potential. This innovative manufacturing process enables different semiconductormaterials to be used in a single chip. It also offers higher performance and more functionality thantraditional chips. 3D heterogeneous chip fabrication is accomplished by combining different semiconductormaterials. These materials may include semiconductors with different electronic properties. While allcomponents are made of the same semiconductor material in traditional chip manufacturing processes, amore complex and advanced structure is obtained by using different materials together in 3D heterogeneouschip production. 3D heterogeneous chip production brings many advantages thanks to the combination ofdifferent materials. Another advantage is to increase energy efficiency with 3D heterogeneous chipproduction. Using different materials together and in a single chip makes it possible to manage energy moreefficiently. Another advantage is that the more complex and dense logic circuits of 3D heterogeneous chipfabrication can be located on the same unit square and on top of each other. In this context, this studypresents the technical details and potential risks of the proposed solution method, along with end-to-endchip production, for the resolution of the mentioned problem.