Advanced modeling of packaged RF MEMS switches and its application on tunable filter implementation

Abstract

This paper presents advanced modeling of a packaged RF MEMS switch considering the effect of packaging, mounting pad and bond-wires. The importance of the switch advanced model for accurate prediction of tunable filter response is also investigated for three different types of RF MEMS tunable filters; a lumped element 25–75 MHz tunable filter, an inductively-loaded microstrip 1.06–1.23 GHz tunable filer and a surface-integrated-waveguide 1.8–2.3 GHz tunable filter.