Evaluation of Dielectric Strength of Tricyclopentadiene / Silica Microcomposites

Abstract

Hydrocarbon-based thermosetting resins have properties such as low viscosity, low dielectric constant and high heat resistance as compared with epoxy resins and are expected to be applied to electric devices in the future. However, hydrocarbon-based thermosetting resins have not been put into practice as an electrically insulating material yet. Therefore, it is necessary to understand the electrical characteristics. Generally, when organic polymeric material is used as an insulator for high voltage equipment, a large amount of loading of inorganic fillers is needed so as to decrease linear expansion coefficient. Therefore, it is crucial to investigate the effect of inorganic filler loading on the various properties such as mechanical, thermal, and electrical properties for higher voltage and longer term operation of highvoltage equipment. From the viewpoints, this paper deals with electrical insulation properties of the hydrocarbon-based thermosetting resin with loaded micro silica particles. As a result, breakdown strength of hydrocarbon-based thermosetting resin is equal or higher than that of the epoxy resin. As a result, it can be said that the hydrocarbon-based thermosetting resin with lower viscosity and lower dielectric constant than the epoxy resin is promising as an insulating material for the next generation high voltage equipment.