Capability of biopolymers in electronics manufacturing

Abstract

The present study aims to display new opportunities for flexible printed circuit boards (FPC) in electronic manufacturing by using biopolymers based on renewable materials as substrate material. Therefore, four different biopolymers, polyhydroxybutyrate (PHB), cellulose acetate (CA) and two different copolymers of polylactid acid and thermoplastic polyester elastomer (PLA+TPC), were processed with the standard process chain of the electronic manufacturing. Thereby, the main focus of attention was the thermal behavior during the hot embossing and reflow soldering in a vapor phase reflow soldering oven. Furthermore, manufactured FPCs were put in a temperature-humidity-test for 200 hours. The aim is to identify the weaknesses of current available biopolymers in order to improve future biopolymers for using in the electronic manufacturing.